Reflow Soldering using Automated Equipment

This article describes the best methods for soldering sensors manufactured by Merit Sensor using automated equipment..

All profiles should be evaluated and tested for the best performance. More and more companies are moving away from the use of conventional tin-lead (Sn/Pb) solder in circuit board manufacturing because of concerns over the safety of lead and new regulations prohibiting its use, such as the Restriction on Hazardous Substances (RoHS) Directive in Europe.

The RoHS Directive bans the European sale of new electrical and electronic equipment containing more than the specified levels of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants. All pressure sensors from Merit Sensor are RoHS compliant and are mounted on ceramic substrates. The lead-free solder pads are plated with AgPt to ensure a good solder joint for most PCB connections. Soldering of Merit Sensor parts can be done using either Pb-containing or Pb-free solder processes.

This application note is intended to assist end users with soldering Merit Sensor parts using either Pb-free solder or Pbcontaining solder. In order to meet the RoHS directive, products should be soldered with Pb-free solder.